XSB: Difference between revisions
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{{Infobox_Component | {{Infobox_Component | ||
|caption = Xbox 360 | |image = XSB-ES.png | ||
|caption = Xbox 360 Engineering Sample Southbridge | |||
|type = Internal/Beta/Retail | |type = Internal/Beta/Retail | ||
|rarity = Common | |rarity = Common |
Revision as of 16:07, 18 February 2019
XSB
The Xbox 360 Southbridge (XSB) is the chipset present on the Xbox 360 motherboard. It is responsible for many management tasks between the XCPU and different I/O present in the system.
History
Hardware
The Xbox 360 Southbridge is a Ball Grid Array (BGA) soldered chip that was custom designed by Microsoft for the Xbox 360.
The XSB handles many important hardware features by acting as a SATA controller, USB controller, System Management Controller (SMC) and NAND controller. It also handles smaller devices such as the eject, bind, tilt switches and IR sensor on the console.[1]
References
- ↑ XENON_FABK Schematics, Microsoft, 24 August 2005
Gallery
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