Xbox 360 Motherboards

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Xenon (V1)

The original Xbox 360 configuration used in the initial Premium and Core machines released in the end of November 2005.
These are also know as the RRoD (Red Ring of Death) machines because the GPU chip warps away from the motherboard because of excessive heat.

• 90 nm IBM CPU
• 90 nm ATI GPU and 90nm on-chip eDRAM
• Low profile GPU cooler
• Standard CPU cooler
• 203 Watt output power supply (16.5 A)
• Shipping with Hitachi and Samsung DVD-Drive
• Highly unlikely to have glue around the CPU but it IS possible.

Zephyr (V2)

Zephyr was the first revision with HDMI connector
It was introduced with the Xbox 360 Elite in May 2007.
In July 2007 Xbox 360 Premium machines began appearing with the Zephyr motherboard.

• 90nm IBM CPU & ATI GPU
• 90nm eDRAM
• 203 Watt PSU (16.5 A)
• HDMI video output
• Updated motherboard layout
• Glue around the CPU
• 3 pin fan connector
• New Extended GPU heatsink with a heatpipe
• New Elite model includes 120 GB hard drive
• Shipping with Hitachi, Samsung and new BenQ DVD-Drive

Falcon (V3)

All Xbox 360 Premium machines and Arcade machines made in August 2007 introduced the new 65 nm CPU accompanied with a new cooler and still 90 nm GPU with the Zephyr cooler.
The motherboard is based on Zephyr and requires fewer components (some capacitors and coils removed) for the new 65 nm CPU, resulting in lower costs.

• 65nm IBM CPU
• 90nm ATI GPU
• 80nm on-chip eDRAM.
• HDMI Video Output
• 175 Watt PSU (2V rated for 14.2A, new connector)
• New CPU Heatsink + the GPU heatsink with heatpipe
• Fewer voltage regulators, capacitors and inductors
• Bigger and enhanced CPU cooler
• Ram removed from bottom of mainboard on later models
• 3 pin fan connector
• Arcade Edition w/256MB Memory Card
• Shipping with BenQ and new LiteOn DVD-Drive

Opus (V3.1)

This is an intermediate motherboard with 65 nm CPU and 90 nm GPU, new coolers, but no HDMI. It will be used in Xenon chassis for repairs and RRoD affected machines.
Started to appear end of July 2008 in machines coming back from repair.

• Falcon based board
• 65 nm IBM CPU
• 90nm ATI GPU with 80nm on-chip eDRAM
• No HDMI Video Output
• 175 Watt PSU (2V rated for 14.2A, new connector)
• Updated Heatsinks
  • Falcon CPU cooler
  • Zephyr GPU cooler
• 3 pin fan connector
• Shipping with Hitachi, Samsung, Benq and LiteOn 7XXX DVD-Drive
• Opus only available from xenon being repaired by MS.

Jasper (V4)

Jasper introduced the 65 nm GPU to reduce power usage and cost further.
The new powersupply is rated for 150 Watt, down form 175 Watt on the Falcon. The Amperage on the 12V rail is down to 12.1A (12.1A x 12V = 145.2W).

The on-board flash has also increased to allow the new NXE (New Xbox Experience) dashboard update to reside internally, instead of requiring a memory unit or the hard drive.

• 65 nm IBM CPU
• 65 nm ATI GPU with 80 nm on-chip eDRAM
• 150 Watt PSU (12V rated for 12.1A, new connector)
• Arcade Edition Larger Flash 256 MB Hynix HY27UF082G2B on-board flash, up from 16 MB HY27US08281A flash, to accommodate the NXE update.
• New southbridge chipset
• Ram removed from bottom of mainboard
• New style CPU Heatsink + the GPU heatsink with heatpipe
• 3 pin fan connector.
• New Warranty Sticker.
• Shipping with LiteOn 7XXX/8XXX/V2/9XXX DVD-Drivers.

Jasper (V4.1)

Same as Jasper (V4), minor changes.

• 65nm eDRAM (?)
• New Southbridge chipset
• Arcade Edition Larger Flash 256MB and 512MB to accommodate NXE (Removes 256MB Memory Card)
• Shipping with LiteOn 8XXXV2/9XXX DVD-Drivers.

Trinity/Valhalla (V5) [New Slim Xbox 360]

• Unified single chip with CPU, GP and eDRAM at 45nm process.
• 16MB NAND
• 135 Watt PSU
• 802.11n Wi-Fi integrated
• No more Memory Unit ports
• Seperate Kinect port
• Different HDD port
• Smaller form factor
• No more RROD, simple red power light on error (unknown on more detail)